发明名称 |
Thermal distribution system |
摘要 |
The present invention relates to high density electronic power supplies and more particularly switching power supplies employing a metallic enclosure and integral cooling means. The configuration employs an array of thermally conductive metal bars to optimally distribute heat from a number of dissipative elements to a thermally conductive metal element that has substantial surface area within an internally generated air stream. The thermally conductive metal element may be the metal enclosure that also acts as a heat sink or fins, both of which provide substantial surface area to the air stream.
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申请公布号 |
US6515858(B2) |
申请公布日期 |
2003.02.04 |
申请号 |
US20010875524 |
申请日期 |
2001.06.06 |
申请人 |
UNIPOWER CORPORATION |
发明人 |
RODRIGUEZ EDWARD T.;FUCHS GARY R. |
分类号 |
H05K7/20;(IPC1-7):H05U7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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