发明名称 Thermal management device and method of making such a device
摘要 A thermal management device includes an isotropic carbon encapsulated in an encapsulating material that improves the strength of the carbon. The encapsulating material may be e.g. polyimide, epoxy resin, acrylic, polyurethane, polyester, or any other suitable polymer.
申请公布号 US6514616(B1) 申请公布日期 2003.02.04
申请号 US20010719478 申请日期 2001.03.05
申请人 QUEEN MARY AND WESTFIELD COLLEGE, UNIVERSITY OF LONDON 发明人 GANDI ANGELO;DE OLIVEIRA RUI;CARTER ANTHONY ARTHUR
分类号 H05K1/05;H01L23/373;H05K3/44;H05K3/46;(IPC1-7):B32B9/00 主分类号 H05K1/05
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