发明名称 HYBRID MODULE
摘要 PROBLEM TO BE SOLVED: To realize miniaturization, reduction of the height and high heat radiation of a hybrid module on which a pyrogenetic integrated element is mounted. SOLUTION: By using an integrated passive element formed by integrating a passive element, a pyrogenetic integrated circuit is also mounted on a recessed part formed on a circuit board, so that miniaturization, reduction of the height and high heat radiation are realized. Thus, a small and low-height hybrid module, on which the pyrogenetic integrated circuit is mounted, is realized.
申请公布号 JP2003031757(A) 申请公布日期 2003.01.31
申请号 JP20010211537 申请日期 2001.07.12
申请人 HITACHI LTD 发明人 MIWA TAKAO;SATO TOSHIYA;OGINO MASAHIKO;NAMATAME TOSHIHIDE;MOTOWAKI NARIHISA;WATABIKI SEIJI;FUKUMOTO EIJI;FURUKAWA YOKO;AKAMINE HITOSHI;ENDO TSUNEO;KUBO SEIJI
分类号 H05K3/34;H01L23/12;H01L23/34;H01L25/00;H05K1/18;H05K3/36;(IPC1-7):H01L25/00 主分类号 H05K3/34
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