| 摘要 |
PROBLEM TO BE SOLVED: To prevent throughput from lowering due to cooling of a substrate incident to evacuation of a load lock chamber. SOLUTION: In a low pressure/normal pressure substrate processor comprising a first processing chamber for processing a substrate in an atmosphere different from the atmosphere, and a second processing chamber, i.e., a load lock chamber 3, being coupled with the first processing chamber 1 and the atmosphere through open/close means, i.e., a first gate valve 4 and a second gate valve 5 respectively, and processing the substrate carried into the first processing chamber 1 through the load lock chamber 3, the load lock chamber 3 is provided with a temperature regulating means 11 for heating the substrate before it is carried into the load lock chamber 3. |
