CONTROL UNIT AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To enhance heat dissipation efficiency of a control unit, and to realize easy manufacturing of the unit. SOLUTION: The device body of a plurality of semiconductor devices 14 is secured to a rear of a heat dissipation member 16 constituting a control unit, and a terminal leg 14a of each semiconductor device 14 is made to project from the rear to a direction almost perpendicular to it and disposed being substantially flush. The terminal legs 14a can be mounted simultaneously on a common circuit substrate 16.