| 摘要 |
PROBLEM TO BE SOLVED: To provide a new substrate for flexible wiring board, the whole body of which has flexibility, and accordingly, can be bent arbitrarily and which has superior thermal conductivity and can quickly dissipate generated heat. SOLUTION: This substrate 1 for flexible wiring board is constituted, by laminating metal foil 41 upon at least one surface of flexible sheet-like graphite 2 via an insulating woven or nonwoven fabric 3. It is also possible to form a plated metal layer on at least one surface of the graphite 2, instead of the metal foil 41.
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