| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer processing apparatus that can control processing liquid atmosphere in a unit effectively. SOLUTION: The wafer processing apparatus for supplying treatment liquid to treat a wafer W is equipped with a support means 57 for supporting the wafer W, an outer chamber 43 for surrounding the support means 57, and a unit chamber 42 for surrounding the outer chamber 43. In the outer and unit chambers 43 and 42, an opening is provided, where the opening can be opened and closed to carry in and carry out the wafer W.</p> |
