| 摘要 |
PROBLEM TO BE SOLVED: To reduce coupling of signal lines without enlarging a size. SOLUTION: One terminal of a signal line 22A is connected to a semiconductor chip 25 by a bonding wire 26A, and the other terminal is connected to a via hole 28. One terminal of a passive component 29 such as capacitor, for example, is connected to the signal line 22A. The other terminal of the passive component 29 is connected through a via hole 30A to a ground layer 23. The ground layer 23 is provided with a slit 31. The slit 31 divides two via holes 30A. The slit 31 is extended from the terminal part of the ground layer 23 to a portion just under the semiconductor chip 25. |
