| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lift-off phenomenon evaluating printed wiring board, having a mechanism capable of comparatively easily electrically evaluating the lift-off phenomenon occurrence. SOLUTION: The lift-off phenomenon evaluating printed wiring board has component insertion through-holes 13 and first and second lands 14A, 14B on which components are mounted, using lead-free solder. The board comprises (A) a first checking wiring 51A, (B) a first checking land 52A, (C) a second checking wiring 51B, and (D) a second checking land 52B.</p> |
