SENSOR AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a sensor where bonding properties in the bonding pad of electrode connected to the contact part of metal wiring can be improved, and to provide the manufacturing method of the sensor. SOLUTION: Metal wirings 3 to 5 are formed on first insulation films 21 and 22, and second insulation films 23 and 24 are formed on metal wirings 3 to 5. An opening part 25 is formed in the second insulation films 23 and 24. The electrode 8 is formed in the contact part 7 via the opening part 25. The electrode 8 is pulled out to the second insulation films from the contact part 7, and a bonding pad part 8a is formed. The metal wirings 3 to 5 are formed up to the positions, corresponding to the bonding pad 8a.