Lead formation, assembly strip test, and singulation system

摘要

An integral system for testing integrated circuits (ICs) mounted on an assembly strip after lead formation and before separation from the assembly strip. The ICs are arranged in rows and columns on each assembly strip such that the sides of each IC are connected to leads extending from the assembly strip, and the ends of each IC are held by the assembly strip. The strips are loaded into the system and passed to a first station at which leads are cut and formed while the ends of each IC remain connected to the assembly strip. The assembly strips are then passed to a test apparatus that transmits test signals to the ICs through the formed leads. The IC devices are then separated from the assembly strip using a singulation apparatus, and the separated ICs are stored in tubes for delivery. Visual inspection is also performed at various stages.