发明名称 |
Device and method for detecting a reliability of integrated semiconductor components at high temperatures |
摘要 |
The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.
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申请公布号 |
US2003020131(A1) |
申请公布日期 |
2003.01.30 |
申请号 |
US20020200934 |
申请日期 |
2002.07.23 |
申请人 |
ASAM WILHELM;FAZEKAS JOSEF;MARTIN ANDREAS;SMEETS DAVID;HAGEN JOCHEN VON |
发明人 |
ASAM WILHELM;FAZEKAS JOSEF;MARTIN ANDREAS;SMEETS DAVID;HAGEN JOCHEN VON |
分类号 |
G01R31/28;G01R31/3173;H01L23/544;(IPC1-7):H01L21/00;H01L31/058 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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