| 摘要 |
An optical subassembly for an optoelectronic module includes an adhesive interface between a lens and an optoelectronic device, e.g., having a laser or a photoelectric receiver chip. In addition to eliminating moisture condensation, the adhesive interface can eliminate damage to a structural adhesive that may occur when air of a conventional interface expands as the structural adhesive is cured. The adhesive interface has optical transmittance at the optoelectronic device's operating wavelength, e.g., 850 nm. The lens surface shape is selected based on the adhesive interface's refractive index. An adhesive is applied both to the lens and to the optoelectronic device, which are then joined and the adhesive cured to form the adhesive interface. The adhesive is cured by exposure to UV radiation and/or heat, for example.
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