发明名称 THERMAL INSULATING MATERIAL FOR FLOOR HEATING-COOLING AND FLOOR HEATING-COOLING STRUCTURE IN WHICH THE MATERIAL IS USED
摘要 PROBLEM TO BE SOLVED: To provide a thermal insulating material, in which a total thickness of the thermal insulating layer of a foamed resin molding is conformed to various requirements in a floor heating-cooling structure having a heating-cooling pipe, a heat-wire heater, etc., as a heat source. SOLUTION: In the thermal insulating material 10 formed of a synthetic resin foam, grooves 11 are formed to place hot-cold heat supply body 20 on the surface. Fitting parts 12 are formed on the rear of the material for stacking the same kind of the material 10. A thermal insulating structure having a required thickness can be obtained by stacking necessary number of sheets in conformity with customer's requirement or a standard for energy-saving in a district in which a house is built. Each material 10 can be made comparatively thin, so the foam-molding efficiency is improved.
申请公布号 JP2003028444(A) 申请公布日期 2003.01.29
申请号 JP20010215194 申请日期 2001.07.16
申请人 SEKISUI PLASTICS CO LTD 发明人 HORIYAMA ICHIRO
分类号 E04F15/18;F24D3/16;F24D13/02;F24F5/00 主分类号 E04F15/18
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