WATER-DISPERSIBLE RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD PUNCHING, SHEET PREPARED THEREFROM, AND PUNCHING METHOD FOR PRINTED CIRCUIT BOARD USING THE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a water-dispersible resin composition for printed circuit board punching which is excellent in accuracy of working position during punching and in throwing power of plating; a sheet for punching; and a punching method for a printed circuit board using the sheet. SOLUTION: This water-dispersible resin composition contains (A) a water-soluble polymer and (B) a polymer containing polymerized units derived from a compound represented by formula (1) (wherein R is H or methyl; and n is an integer of 10-22). A sheet for punching prepared from the resin composition and a punching method for a printed circuit board using the sheet are also provided.