| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a porous polyimide resin capable of forming pores keeping exactly a shape of a micro-phase separation structure in which dispersing compound, are dispersed in a polyimide resin precursor, and having a low dielectric constant, excellent in mechanical strength and heat resistance, and to provide a porous polyimide resin obtained by the method. SOLUTION: A film 7 consisting of a porous polyimide resin 6 is formed by the following steps: A resin solution 2 containing a polyimide resin precursor 4 and a dispersing compound 3 is applied on a base material 1. The solvent is evaporated to form a film 5 in which the dispersing compounds 3 are dispersed in the polyimide resin precursor 4. The dispersing compounds 3 are removed by extraction to make the film porous. The film 5 is preheated in the temperature range of 190-250 deg.C followed by imidation. |
