WAFER BAKING APPARATUS HAVING ABSORBING TYPED PINS

摘要

PURPOSE: A wafer baking apparatus having absorbing typed pins is provided to buffer a shock due to the external force and exchange easily the absorbing typed pins by using the absorbing typed pins. CONSTITUTION: A pin body(124) is formed with an elastic body in order to buffer impact applied from the outside. A plate(126) for fixing pin is formed at one end portion of the pin body(124) in order to fix a pin(120) to the plate(126) for fixing pin. A plurality of absorbing typed pins(120) are formed at the other end portion of the pin body(124). The absorbing typed pins(120) have caps(122). The caps(122) can be separated from the pin body(124) when the external force is applied to the pin body(124). A screw of the plate(126) for fixing pin is combined with a pin insertion hole(170) of a pin fixing plate(180).