| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in sensitivity, developability and residual film rate and capable of forming a positive resist film excellent in heat and chemical resistances, adhesion to a substrate and transparency in the visible light region. SOLUTION: The positive type radiation sensitive resin composition contains an alkali-soluble unsaturated resin, a quinonediazido compound and a crosslinker having a functional group capable of forming crosslinking in the midst of the alkali-soluble unsaturated resin. The alkali-soluble unsaturated resin used in the composition is a resin obtained by reacting the reaction product of an epoxy compound of formula (1) (where each R is H, a 1-5C linear or branched alkyl, phenyl or halogen) and (meth)acrylic acid with at least one polybasic carboxylic acid or its anhydride. |
