Multilayer circuit board and method for manufacturing multilayer circuit board

摘要

A multilayer circuit board (100) that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers (22) are formed on a resin film (23) made of thermoplastic resin to form a single-sided conductor layer film (21). Then, a plurality of via-holes (24), which are bottomed by the conductor layers (22), are formed in the resin film (23). Then interlayer connecting material (50) is packed in the via-holes (24) to form a single-sided conductor layer film (21) having the interlayer connecting material (50). A plurality of single-sided conductor layer films (21,31) are formed and stacked such that surfaces having the conductor layers (22) face in the same direction. Then, the single-sided conductor layer films (21,31) are pressed and heated to complete the multilayer circuit board (100). The multilayer circuit board (100) is formed by using only the single-sided conductor layer films and pressing once, so the manufacturing process is simplified.