EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which has good fluidity and moldability and can decrease its warpage deformation even when used for sealing an electronic part device (e.g. a BGA of a batch mold type); and an electronic part device having an element sealed with the molding material. SOLUTION: This epoxy resin molding material contains, as essential ingredients, an epoxy resin (A) and a premixture of a curing agent (B) and a silicone compound (C) having an epoxy group or groups. The electronic part device has an element sealed with the molding material.