| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive element excellent in adhesion, resolution, resist shape, plating resistance and chemical resistance. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond in one molecule and also having at least one ethylene glycol chain and at least one alkylene glycol chain selected from the group comprising 3-6C alkylene glycol chains in one molecule, (C) a photopolymerization initiator and (D) a compound of formula (I) (where X is a halogen, H, a 1-20C alkyl, a 3-10C cycloalkyl, aryl for which amino or a 1-20C alkyl may be substituted, amino, mercapto, a 1-10C alkylmercapto, carboxyalkyl whose alkyl moiety is a 1-10C alkyl, a 1-20C alkoxy or a heterocyclic group). |
