| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of freely regulating a polishing shape in the neighborhood of an edge part of a wafer by devising it to be capable of freely regulating tensile force of a membrane to transmit pressurizing force to the wafer and easily carrying out setting of retainer ejecting quantity. SOLUTION: A retainer ring 26 to regulate movement of the wafer W in the diametrical direction is provided with a tensile force regulation means 30 to regulate tensile force of the membrane 32 and a retainer ejecting quantity regulation means 50, the tensile force regulation means 30 is constituted of a holding ring 28 to hold the membrane 32 and a contact ring 27 to make contact with the membrane 32 on a circumference of the inside of the holding ring 28, the tensile force is regulated by strength of fastening force of a screw mounting the holding ring 28 on the contact ring 27 and the retainer ejecting quantity regulation means 50 is constituted so as to regulate the retainer ejecting quantity by strength of the fastening force of the screw fastening a retainer main body 26A and the contact ring 27 or fastening them by putting a shim 27C regulating its thickness on a fastening surface of the retainer main body 26A and the contact ring 27. |
