| 摘要 |
Socketable flexible circuit based electronic device modules (14, 74) and sockets (12, 72) for electrically and mechanically connecting the electronic device modules (14, 74) to an interconnect substrate are described. The systems provide ways in which electronic device modules (14, 74) may be positioned accurately and securely on an interconnect carrier, while allowing the electronic device modules (14, 74) to be replaced easily without having to resort to laborious desoldering and resoldering operations to remove the modules (14, 74) and connect new modules (14, 74) in their place. <IMAGE> |
