| 摘要 |
<p>A lighting device using a light-emitting device with improved heat dissipation is offered. A lighting device with a light-emitting device mounted on a metal substrate (71) is offered. The light-emitting device consists of a plurality of conductive passages (51A, 51B) electrically separated from each other, an optical semiconductor element (25) attached to a desired conductive passage (51A, 51B) and a transparent resin (67) covering the optical semiconductor element. (25) and supporting the conductive passages (51A, 51B) in one piece. The method provides a light-emitting device consisting of a plurality of conductive passages (51A, 51B) electrically separated from each other, an optical semiconductor element (25) attached to a desired conductive passage (51B) and a transparent resin (67) covering the optical semiconductor element (25) and supporting the conductive passages (51A, 51B) in one piece.</p> |
