| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive resin composition for IC packaging. SOLUTION: The electroconductive resin composition for IC packaging comprises (A) a thermoplastic resin being a polyphenylene ether-based resin, (B) carbon black and (C) an ethylene-α-olefin copolymer resin, wherein (a): the electroconductive resin composition contains 5-50 pts.wt. of (B) the carbon black per 100 pts.wt. of (A) the thermoplastic resin and 1-30 pts.wt. of (C) the ethylene-α-olefin copolymer resin having a surface hardness, of 90 or less as Durometer A type surface hardness stipulated in JIS-K-7215 per 100 pts.wt. of the total amount of (A) the thermoplastic resin and (B) the carbon black and (b): the electroconductive resin composition has a surface resistivity of 10<2> -10<10>Ωand carbon black is less liable to fall off from the surface of a molded product formed from the electroconductive resin composition. A molded product and a sheet for IC packaging formed from the electroconductive resin composition are provided.
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