发明名称 |
Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same |
摘要 |
A conductive-member adsorbing device has an adsorber having adsorption portions for adsorbing conductive members and a force supply unit. The force supply unit is operative to apply a force which can maintain one conductive member adsorbed by one adsorption portion, but can release two conductive members adsorbed by one adsorption portion.
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申请公布号 |
US6512294(B1) |
申请公布日期 |
2003.01.28 |
申请号 |
US20000592570 |
申请日期 |
2000.06.12 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
SHIOZAWA MASAKUNI;SHINDO TOMOYUKI |
分类号 |
H01L21/60;B23K3/06;H01L21/48;H01L21/683;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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