| 摘要 |
A MEMS relay is provided. The MEMS relay includes a first wafer, a second wafer, and a third wafer that are sequentially stacked. The first wafer includes driving electrodes positioned at the bottom surface of the first wafer, input signal electrodes and output signal electrodes formed adjacent to each other and corresponding to the driving electrodes, via holes formed through the first wafer on the driving electrodes, the input signal electrodes, and the output signal electrodes, and metal pads formed over the via holes. The second wafer includes a body including a sealing unit used to hermetically seal the first and third wafers with the second wafer interposed therebetween, a driving unit which is formed inside and isolated from the body, is an integrated body consisting of a silicon substrate, a passivation layer formed on the silicon substrate, and contact electrodes formed on the passivation layer, and is located lower than the top surface of the body by a predetermined distance, and a connection supporter which extends from two opposing sides of the driving unit to the inner surface of the body. The third wafer includes a hollow in which the driving unit can be rotated.
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