| 摘要 |
PROBLEM TO BE SOLVED: To provide an injection molded printed wiring board having fine wiring parts and through holes. SOLUTION: Thermoplastic resin is injection molded using a stamper provided with protrusions for forming fine wiring parts 16 and through holes 11 thus obtaining recesses 10 and through holes for wiring. A conductor layer is then formed on an injection molded substrate 9 to bury the wiring parts and the through holes. Furthermore, the conductor layer is removed from the parts other than the wiring parts by polishing the entire surface of the injection molded substrate uniformly.
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