| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity and giving a cured body excellent in storage stability, resolution, surface gloss, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, PCT resistance, thermal shock resistance, etc. SOLUTION: In the photosensitive resin composition containing a resin (A) soluble in an aqueous alkali solution, a photopolymerization initiator (B), a photocrosslinker (C), a heat curable component (D) and a curing catalyst (E), the curing catalyst (E) is a compound having a 1,4-dihydropyridine backbone which may have an N-substituent. |
