| 摘要 |
PROBLEM TO BE SOLVED: To obtain a novel checking apparatus for a semiconductor device without using a probe card. SOLUTION: The checking apparatus for the semiconductor device comprises a wafer stage 1 having a wafer-mounting surface, an X-axis guide passage 6 which is extended along the X-axis direction above the mounting surface, moving members 7a to 7d on the X-axis mounted on the passage 6 movably in the X-axis direction, an X-axis drive unit 8 for driving the members 7a to 7d along the passage 6, probes 10a to 10d respectively mounted at the members 7a to 7d and contacting the wafer at the time of checking, a Y-axis guide passage 2 extended along the Y-axis direction above the wafer mounting surface, a member 4 moving the Y-axis mounted at the passage 2 movable in the Y-axis direction and fixed to the passage 6, a Y-axis drive unit 5 for driving the member 4 along the passage 2, and a Z-axis drive unit 3 for driving the probes 10a to 10d in the Z-axis direction. The checking apparatus further comprises controllers 9 respectively connected to the X-axis drive unit 7, the Y-axis drive unit 5 and the Z-axis drive unit.
|
