| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin having excellent photosensitivity, flexibility and resistances of a cured product to solder heat, heat deterioration and electroless gold plating, developable with an organic solvent or a dilute alkaline solution and especially suitable for solder resists and interlayer dielectric insulations. SOLUTION: This resin composition comprises (A) an oligomer prepared by reacting (a) a spiroglycol with (b) a tetracarboxylic dianhydride compound, (c) a maleimide group-containing mono- or polyhydroxy compound and (d) a polyol compound other than the component (a) as an optional component and (B) a diluent. |
