| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in a conventional power semiconductor module that a terminal metal fixture for external connection is fixed to a frame body in a peripheral part of the module, a connection part of a copper circuit of a semiconductor chip fixing part and the terminal metal fixture is a weak part position, connection using a long bonding wire is applied, or soldering is used by making the terminal metal fixture abut against the copper circuit, and management of stable junction quality is required by improving the connection of the part position. SOLUTION: The terminal metal fixture for external connection is formed by bonding at an arbitrary position near a power semiconductor chip on the copper circuit, thereby excluding butt soldering between the copper circuit of a semiconductor chip fixing part and the terminal metal fixture. |
