AUTOMATED SPRAY CLEANING APPARATUS FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To equally and completely remove particles and organic contaminants from a semiconductor wafer (11) by sweeping the wafer with a hydraulic broom for spraying a cleaning solvent onto the wafer. SOLUTION: The broom is provided with an aspirating nozzle (3) to be linked to a source of pressurized gas such as nitrogen and a source of cleaning fluid such as acetone, and the cleaning fluid aspirated by a gas stream is discharged through a nozzle outlet and impacts the surface of the wafer so that particulate matter and dissolved organic contaminants can be removed. A programmed controller (9) controls the movement of the hydraulic broom relative to the wafer so that the entire surface can be cleaned and various kinds of sweep patterns can be provided.