| 摘要 |
The present invention relates to, inter alia, a composition for stripping photoresist from substrates comprising: about 5 % to about 50 % by weight of an alkyl substituted pyrrolidone, an alkyl substituted piperidone, or a mixture thereof; about 0.2 % to about 20 % of one or more alkanolamines, and about 50 % to about 94 % of a sulfoxide, sulfoxone, or mixture thereof. Advantageously, the composition can remove copper from a copper substrate at a rate of less than about 10 ANGSTROM per minute when the substrate is immersed in the composition which is held at 70 DEG C for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
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