发明名称 Process for mass prodcution of plates for holding connection pins of electronic components
摘要 In order to mass produce plates for holding connection pins of an electronic component in a predefined configuration, used to facilitate the mounting of the component on a printed circuit board, this process consists of introducing a board (11) of large dimensions into a numerically-controlled machine tool, operating the machine tool in order to create in board (11) perforations (12) whose diameter corresponds to that of the pins of the component, and to operate the machine tool in order to make precutting lines (13, 14) in board (11), so as to precut a plurality of plates (21) in the board, the precutting lines being distributed over the board so that each plate has perforations (12) having the predefined configuration.
申请公布号 US2003014864(A1) 申请公布日期 2003.01.23
申请号 US20020177494 申请日期 2002.06.20
申请人 GAZELOT YVES;ROBIN THIERRY 发明人 GAZELOT YVES;ROBIN THIERRY
分类号 H05K3/00;H05K3/30;(IPC1-7):H05K3/30;H05K3/02 主分类号 H05K3/00
代理机构 代理人
主权项
地址