发明名称 Structure and method for fabricating an integrated phased array circuit
摘要 Phased array components utilizing two or more different types of semiconductor in one monolithic device are provided. High quality epitaxil layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxil growth of single crystal silicon onto single crystal oxide, and epitaxil growth of Zintl phase materials.
申请公布号 US2003017722(A1) 申请公布日期 2003.01.23
申请号 US20010905933 申请日期 2001.07.17
申请人 MOTOROLA, INC 发明人 EMRICK RUDY M.
分类号 C30B25/02;C30B25/18;H01L21/20;H01L21/768;H01L21/8258;H01L27/06;(IPC1-7):H01L21/00;C30B1/00;H01L21/36;H01L21/31;H01L29/76 主分类号 C30B25/02
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