发明名称 MOLDED POLYGLYCOLIC ACID
摘要 <p>A polyglycolic acid molding comprising polyglycolic acid as the main component, in which the polyglycolic acid has a melt viscosity of 20 to 500 Pa·s, excluding 500 Pa·s, as measured at a temperature higher by 20°C than the melting point and a shear rate of 100 /sec and which is a molding formed by compression molding, extrusion molding, blow molding, or solution casting molding. Also provided is a multilayered molding having a layer constitution comprising a polyglycolic acid layer and formed on at least one side thereof a thermoplastic resin layer, wherein the polyglycolic acid contained in the layer consisting mainly of the polyglycolic acid has a melt viscosity of 20 to 500 Pa·s, excluding 500 Pa·s, as measured at a temperature higher by 20°C than the melting point and a shear rate of 100 /sec.</p>
申请公布号 WO2003006535(P1) 申请公布日期 2003.01.23
申请号 JP2002007006 申请日期 2002.07.10
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