SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package is provided to improve physical connection intensity of a conduction part in a conduction treatment of an inner circumferential surface of a via hole by making the via hole formed of a long hole type. CONSTITUTION: A plurality of interconnection patterns of a semiconductor package(2) are formed as a matrix type between both surfaces of a substrate(1) whose double surfaces are covered with copper. The via hole(3) for forming a conduction path between both surfaces of the substrate is formed between the interconnection patterns of the unit semiconductor package, made of a long hole type. After a semiconductor chip(20) is attached to a predetermined position of the interconnection pattern, the entire substrate is resin-sealed after interconnections are completed.