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发明名称
HYBRID MODULE
摘要
<p>A hybrid module which uses an integrated passive element formed by integrating passive elements, and is mounted thereon with a small/low profile, heating integrated circuit that is mounted in a recess formed in a circuit board.</p>
申请公布号
WO2003007374(P1)
申请公布日期
2003.01.23
申请号
JP2002007090
申请日期
2002.07.12
申请人
发明人
分类号
主分类号
代理机构
代理人
主权项
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