发明名称 Solventless, resistless direct dielectric patterning
摘要 Processes for patterning radiation sensitive layers are disclosed. In one embodiment, the process includes depositing a radiation sensitive material on a substrate by chemical vapor deposition. The radiation sensitive material is exposed to radiation to form a pattern and the pattern is developed using a supercritical fluid (SCF).
申请公布号 US6509138(B2) 申请公布日期 2003.01.21
申请号 US20000482193 申请日期 2000.01.12
申请人 SEMICONDUCTOR RESEARCH CORPORATION;CORNELL RESEARCH FOUNDATION, INC.;MASSACHUSETTS INSTITUTE OF TECHNOLOGY 发明人 GLEASON KAREN K.;OBER CHRISTOPHER;HERR DANIEL
分类号 G03F7/16;G03F7/32;G03F7/36;(IPC1-7):G03F7/26 主分类号 G03F7/16
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