| 摘要 |
PROBLEM TO BE SOLVED: To provide a both side polishing method and both side polishing apparatus capable of performing favorable machining without causing rolled edge sagging in the outer peripheral part of a work piece such as a wafer. SOLUTION: The work piece 9 loaded with a pressure ring 8, 11, 12, 13, 14 is mounted in an opening of a carrier plate 5. At this time, the thickness of the work piece 9 is larger than the maximum thickness of the pressure rings 8, 11, 12, 13, 14. |
