发明名称 END POLISHING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an end polishing apparatus capable of polishing with very small load, reducing a polishing cost, and simplifying a polishing process. SOLUTION: In this end polishing apparatus, a bar-like member mounted on a tool 20 is pressed to be polished by a polishing member mounted on a polisher 85 rotatably and rockably supported on the apparatus body. The apparatus body is provided with a mass cancel spring 36 for energizing the tool 20 toward the opposite side to the polisher 85 and supporting the tool 20, an energizing spring 37 for energizing the tool 20 toward the polisher 85 against the energizing force of the mass cancel spring 36, and an adjusting means for adjusting the energizing amount of the energizing spring 37.
申请公布号 JP2003019663(A) 申请公布日期 2003.01.21
申请号 JP20010208393 申请日期 2001.07.09
申请人 SEIKO INSTRUMENTS INC 发明人 OZAWA AKIO;MINAMI KOJI
分类号 B24B7/16;B24B19/00;B24B41/06;(IPC1-7):B24B41/06 主分类号 B24B7/16
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