发明名称 MOLD ASSEMBLY AND INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a mold assembly which can reduce the warpage and distortion of a molding, can easily and stably transfer a minute uneven part to the surface of the molding, and is excellent in durability. SOLUTION: The mold assembly (A) is composed of the first mold part 10 and the second mold part 11, and has a mold for molding the thermoplastic resin molding in which a cavity 13 is formed when the mold is clamped, (B) a cavity insert 20 arranged in the first mold part 10, (C) a stamper 27 made of a metal film which is mounted freely attachably/detachably on the surface of the cavity insert 20 facing the cavity 13 and has an uneven part on the surface, and (D) a gate part 12. The cavity insert 20 is manufactured from a material 1.3-6.3 (W/m.K) in thermal conductivity, at least 550 kg/mm<2> in Vickers hardness, at least 4.9×10<10> N/m<2> , and 0.5-5.0 mm in thickness.
申请公布号 JP2003019717(A) 申请公布日期 2003.01.21
申请号 JP20020124352 申请日期 2002.04.25
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 TAWARA HISASHI;KANEISHI AKIMASA;UEDA MASAYA;MARUYAMA HIROYOSHI
分类号 B29C33/38;B29C45/26;B29C45/56;B29L17/00;G11B7/26;(IPC1-7):B29C33/38 主分类号 B29C33/38
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