发明名称 Method of mounting an electrical receptacle on a substrate
摘要 A method of mounting a banana-type electrical receptacle on the substrate includes the steps of placing the electrical receptacle over an aperture formed in the substrate with support ribs formed on the outer surface of the receptacle supporting the receptacle over the aperture. A deformable electrical lead extends from a centrally disposed conductive member making an electrical connection with an electrical contact on the substrate. The electrical lead is affixed to the electrical contact on the substrate and the receptacle is inserted into the aperture crushing or shearing the support ribs and the deforming the electrical lead. Alignment ribs formed on the outer surface of the receptacle have shoulders that contact the substrate for positioning the receptacle in the substrate. The mounting method is compatible with automated soldering processes, such as wave flow soldering.
申请公布号 US6507998(B1) 申请公布日期 2003.01.21
申请号 US19980035674 申请日期 1998.03.05
申请人 TEKTRONIX, INC. 发明人 LYFORD J. STEVE;ROSETTE DAVID
分类号 H01R12/16;H01R13/73;H01R24/00;H01R43/00;H01R43/16;H01R43/24;H05K3/30;H05K3/34;(IPC1-7):H05K3/34 主分类号 H01R12/16
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