发明名称 |
Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
摘要 |
In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.
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申请公布号 |
US6510059(B2) |
申请公布日期 |
2003.01.21 |
申请号 |
US20010889523 |
申请日期 |
2001.07.18 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MITANI TSUTOMU;ISHIMARU YUKIHIRO;KITAE TAKASHI;TAKEZAWA HIROAKI |
分类号 |
C09J9/02;H01L23/498;H05K3/30;H05K3/32;(IPC1-7):H05K1/18 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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