| 摘要 |
PROBLEM TO BE SOLVED: To provide a chemical machine polishing apparatus capable of making the polishing rate substantially uniform within the polishing surface and easily providing good flatness all over on a board. SOLUTION: A board holder 20 is provided with a plurality of heaters 25 and a plurality of temperature sensors 26. While a board 2 held by the board holder 20 is heated with a heater 25, a film to be polished formed on the board 2 is polished. A temperature correction amount for obtaining a desired polishing rate on the whole of the polishing surface is preset by a temperature correction amount setting means 32, and the heaters 25 are controlled by a heater controller 31 so that the heating temperatures of the heaters 25 detected by the temperature sensors 26 correspond to the preset temperature correction amount. |
