| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting semiconductor device capable of improving a mounting positional accuracy by preventing occurrence of an unevenness of a mounting position. SOLUTION: A semiconductor chip 2 is die bonded onto a printed substrate 1. A through hole 4 which passes through the substrate 1 is provided at the substrate 1. A part 3a for sealing the chip 2, a part 3b for fully filling in an inside of the hole 4 and a protruding part 3c protruded to an opposite side to a semiconductor chip mounting side of the substrate 1 are integrated to constitute a resin 3. |
