发明名称 |
APPARATUS FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MOUNTING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To improve product yield by preventing product defects from occurring due to a backup member. SOLUTION: An apparatus for mounting an electronic component mounts the electronic component on a substrate by using a pressurizing tool 6 in the state that the substrate is supported by the backup member 5. The apparatus is provided with a cleaning apparatus 7 for cleaning the backup surface 5a of the backup member 5.
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申请公布号 |
JP2003017528(A) |
申请公布日期 |
2003.01.17 |
申请号 |
JP20010201514 |
申请日期 |
2001.07.02 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
HIROSE YOSHITAKE |
分类号 |
H01L21/60;B08B1/00;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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