发明名称 APPARATUS FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MOUNTING THE SAME
摘要 PROBLEM TO BE SOLVED: To improve product yield by preventing product defects from occurring due to a backup member. SOLUTION: An apparatus for mounting an electronic component mounts the electronic component on a substrate by using a pressurizing tool 6 in the state that the substrate is supported by the backup member 5. The apparatus is provided with a cleaning apparatus 7 for cleaning the backup surface 5a of the backup member 5.
申请公布号 JP2003017528(A) 申请公布日期 2003.01.17
申请号 JP20010201514 申请日期 2001.07.02
申请人 SHIBAURA MECHATRONICS CORP 发明人 HIROSE YOSHITAKE
分类号 H01L21/60;B08B1/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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