| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligner, having an improved mark detecting function which can detect the position of a mark image with high accuracy, when a mark on a wafer is detected by detection light (alignment light) from a light source whose wavelength width is wide, and to provide the manufacturing method of a semiconductor chip. SOLUTION: The aligner is provided with a projection optical system for projecting the pattern of reticle on the wafer with alignment light and a detecting means for irradiating the wafer with detection light having a plurality of wavelengths different from the alignment light and detecting information on the mark of the wafer for relative positioning reticle and the wafer. Detection light has a plurality of wavelengths. In the detection means, luminous flux which is generated on a detection face and which image-forms two wedges correcting the deviation of the mark images between a plurality of wavelengths on the detection face is disposed in a position in a convergence state.
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