发明名称 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD FORMED THEREBY
摘要 <p>PROBLEM TO BE SOLVED: To provide the manufacturing method of a printed circuit board for simplifying a manufacturing process, even in the printed circuit board where an electric element is incorporated into an insulating base, and to provide the printed circuit board formed by the manufacturing method. SOLUTION: An electric element 41 is inserted into a recess 82 of a sheet member 81 made of a thermoplastic resin, the inserted electric element 41 is laminated with a one-sided conductor pattern film 21, where a conductor pattern 22 is formed merely at one side of a resin film 23 made of the thermoplastic resin and a heat sink 46, as shown in Fig. (e), and then heating press is applied to from both the sides for obtaining a printed circuit board 100 as shown in Fig. (f). At this time, an electrode 42 of the electrical element 41 is connected to the conductor pattern 22 electrically, and at the same time, the resin film 23 and sheet member 81 are mutually subjected to thermal fusing and at the same time plastic deformation for sealing the electrical element 41.</p>
申请公布号 JP2003017859(A) 申请公布日期 2003.01.17
申请号 JP20010204023 申请日期 2001.07.04
申请人 DENSO CORP 发明人 KONDO KOJI
分类号 H05K1/11;H01L23/12;H05K1/02;H05K1/18;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
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